EVK105CH0R9BW-F [TAIYO YUDEN]
Please read this notice before using the TAIYO YUDEN products.;
| 型号： | EVK105CH0R9BW-F |
| 厂家： | 
TAIYO YUDEN (U.S.A.), INC |
| 描述： | Please read this notice before using the TAIYO YUDEN products. |
| 文件： | 总21页 (文件大小：691K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Notice for TAIYO YUDEN productsꢀ
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2013. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that TAIYO YUDEN CO., LTD. shall not be responsible for any defects in products or equipment incor-
porating such products, which are caused under the conditions other than those specified in this catalog or indi-
vidual specification.
■ Please contact TAIYO YUDEN CO., LTD. for further details of product specifications as the individual specification
is available.
■ Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact TAIYO YUDEN CO., LTD. for more detail in ad-
vance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called“TAIYO YUDEN’s official sales channel”).
It is only applicable to the products purchased from any of TAIYO YUDEN’s official sales channel.
■ Please note that TAIYO YUDEN CO., LTD. shall have no responsibility for any controversies or disputes that may
occur in connection with a third party's intellectual property rights and other related rights arising from your usage
of products in this catalog. TAIYO YUDEN CO., LTD. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to“Foreign Exchange and For-
eign Trade Control Law”of Japan,“U.S. Export Administration Regulations”, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
MULTILAYER CERAMIC CAPACITORS
WAVE
REFLOW
■PARTS NUMBER
△＝Blank space
J
M
K
3
1
6
△
⑤
B
J
1
0
6
M
L
－
⑩
T
△
⑫
①
②
③
④
⑥
⑦
⑧
⑨
⑪
①Rated voltage
③End termination
Code
P
Rated voltage［VDC］
Code
End termination
2.5
4
K
S
Plated
A
Cu Internal Electrodes
J
6.3
10
④Dimension（L×W）
Type
L
Dimensions
E
16
EIA（inch）
（L×W）［mm］
0.4 × 0.2
T
25
042
063
01005
0201
0402
0204
0603
0306
0805
0508
1206
1210
1812
G
U
35
0.6 × 0.3
50
1.0 × 0.5
H
100
250
630
105
107
212
0.52× 1.0 ※
1.6 × 0.8
Q
S
0.8 × 1.6 ※
2.0 × 1.25
1.25× 2.0 ※
3.2 × 1.6
②Series name
Code
M
Series name
316
325
432
Multilayer ceramic capacitor
3.2 × 2.5
V
Multilayer ceramic capacitor for high frequency
LW reverse type multilayer capacitor
4.5 × 3.2
W
Note : ※LW reverse type（□WK） only
⑤Dimension tolerance
Code
△
Type
ALL
063
L［mm］
W［mm］
T［mm］
Standard
Standard
Standard
0.6±0.05
1.0±0.10
0.3±0.05
0.3±0.05
0.5±0.10
105
0.5±0.10
107
1.6＋0.15/－0.05
0.8＋0.15/－0.05
0.8＋0.15/－0.05
0.45±0.05
A
212
2.0＋0.15/－0.05
1.25＋0.15/－0.05
0.85±0.10
1.25＋0.15/－0.05
0.85±0.10
316
3.2±0.20
1.6±0.20
1.6±0.20
325
105
3.2±0.30
2.5±0.30
2.5±0.30
1.0＋0.15/－0.05
0.5＋0.15/－0.05
0.5＋0.15/－0.05
0.45±0.05
107
212
1.6＋0.20/－0
2.0＋0.20/－0
0.8＋0.20/－0
1.25＋0.20/－0
0.8＋0.20/－0
0.85±0.10
B
C
1.25＋0.20/－0
1.6±0.30
316
105
3.2±0.30
1.6±0.30
1.0＋0.20/－0
0.5＋0.20/－0
0.5＋0.20/－0
Note: P.6 Standard external dimensions
△= Blank space
⑥Temperature characteristics code
■High dielectric type（Excluding Super low distortion multilayer ceramic capacitor（CFCAPTM））
Applicable
standard
Temperature
range［℃］
Capacitance
tolerance
±10％
Tolerance
Code
Ref. Temp.［℃］
Capacitance change
±10％
code
K
JIS
B
－25～＋ 85
－55～＋ 85
－55～＋125
－55～＋105
－55～＋125
－55～＋ 85
20
25
25
25
25
25
±20％
M
BJ
±10％
K
EIA
EIA
EIA
EIA
EIA
X5R
X7R
X6S
X7S
X5R
±15％
±20％
M
±10％
K
B7
C6
±15％
±20％
M
±10％
K
±22％
±20％
M
±10％
K
C7
±22％
±20％
M
±10％
K
LD(※)
△F
±15％
±20％
M
JIS
EIA
F
－25～＋ 85
－30～＋ 85
20
25
＋30/－80％
＋22/－82％
＋80/－20％
＋80/－20％
Z
Z
Y5V
Note : ※.LD Low distortion high value multilayer ceramic capacitor
△= Blank space
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
4
■Temperature compensating type
Applicable
Temperature
range［℃］
Capacitance
tolerance
±0.1pF
±0.25pF
±0.5pF
±1pF
Tolerance
Code
Ref. Temp.［℃］
Capacitance change
0±60ppm/℃
standard
code
B
C
D
CG
CH
EIA
C0G
－55～＋125
25
F
±5％
J
±0.1pF
±0.25pF
±0.5pF
±1pF
B
JIS
EIA
CH
20
25
C
D
－55～＋125
0±60ppm/℃
F
C0H
±5％
J
±10％
K
JIS
EIA
JIS
EIA
JIS
CJ
C0J
CK
20
25
20
25
20
CJ
CK
－55～＋125
－55～＋125
0±120ppm/℃
0±250ppm/℃
±0.25pF
±0.25pF
C
C
C0J
UJ
±0.25pF
±0.5pF
±5％
C
D
J
UJ
－55～＋125
－750±120ppm/℃
EIA
U2J
25
JIS
EIA
JIS
UK
U2K
SL
－55～＋125
－55～＋125
－55～＋125
20
25
20
UK
SL
－750±250ppm/℃
±0.5pF
±5％
C
J
+350～－1000ppm/℃
⑥Series code
⑨Thickness
（Super low distortion multilayer ceramic capacitor（CFCAPTM）only）
Code
C
D
Thickness［mm］
0.2
Code
SD
Series code
Standard
P
0.3
0.45
0.5
⑦Nominal capacitance
T
Code
K
Nominal capacitance
（example）
V
0R5
0.5pF
1pF
W
A
010
0.8
100
10pF
D
0.85(212type or more)
101
100pF
1,000pF
10,000pF
0.1μF
1.0μF
10μF
100μF
F
1.15
1.25
1.6
102
G
L
103
104
N
1.9
105
Y
2.0 max
2.5
106
M
107
Note : R＝Decimal point
⑩Special code
Code
－
Special code
Standard
⑧Capacitance tolerance
Code
B
Capacitance tolerance
±0.1pF
⑪Packaging
Code
C
±0.25pF
±0.5pF
Packaging
D
F
T
φ178mm Taping （2mm pitch）
φ178mm Taping （4mm pitch）
F
±1pF
G
±2％
φ178mm Taping （4mm pitch, 1000 pcs/reel）
325 type（Thickness code M）
P
J
±5％
K
±10％
W
φ178mm Taping（1mm pitch）042type only
M
Z
±20％
＋80/－20％
⑫Internal code
Code
△
Internal code
Standard
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
5
Dimension [mm]
T
Type( EIA )
Ｌ
Ｗ
*1
C
D
C
P
T
e
□MK042（01005）
□VS042（01005）
□MK063（0201）
0.4±0.02
0.4±0.02
0.6±0.03
0.2±0.02
0.2±0.02
0.3±0.03
0.2±0.02
0.2±0.02
0.3±0.03
0.1±0.03
0.1±0.03
0.15±0.05
0.2±0.02
0.3±0.03
0.5±0.05
0.5±0.05
0.3±0.05
0.45±0.05
0.8±0.10
0.5±0.05
0.45±0.05
0.85±0.10
1.25±0.10
0.85±0.1
0.85±0.10
1.15±0.10
1.25±0.10
1.6±0.20
0.85±0.10
1.15±0.10
1.9±0.20
1.9+0.1/-0.2
2.5±0.20
2.5±0.20
C
P
V
W
P
K
□MK105（0402）
1.0±0.05
0.5±0.05
0.25±0.10
□VK105（0402）
1.0±0.05
0.5±0.05
1.0±0.05
0.25±0.10
0.18±0.08
□WK105（0204）※
0.52±0.05
□MK107（0603）
1.6±0.10
0.8±0.10
0.8±0.10
1.6±0.10
0.35±0.25
0.25±0.15
A
Ｖ
K
□WK107（0306）※
e
□MK212（0805）
2.0±0.10
1.25±0.10
2.0±0.15
D
G
Ｄ
D
Ｆ
G
L
0.5±0.25
0.3±0.2
※ LW reverse type
□WK212（0508）※
1.25±0.15
□MK316（1206）
3.2±0.15
1.6±0.15
0.5+0.35/-0.25
D
F
□MK325（1210）
□MK432（1812）
3.2±0.30
4.5±0.40
2.5±0.20
3.2±0.30
N
Y
0.6±0.3
0.9±0.6
M
M
Note : ※. LW reverse type, *1.Thickness code
■STANDARD QUANTITY
Dimension
Standard quantity［pcs］
Type
042
EIA（inch）
01005
［ｍｍ］
0.2
Code
C
D
P
Paper tape
Embossed tape
－
40000
063
0201
0402
0.3
15000
－
T
0.2
0.3
C
P
20000
15000
－
－
105
V
W
P
0.5
10000
－
0204 ※
0603
0.30
0.45
0.8
K
4000
－
－
4000
－
107
212
A
V
K
0306 ※
0.50
0.45
0.85
1.25
0.85
0.85
1.15
1.25
1.6
4000
0805
D
G
D
D
F
－
3000
－
0508 ※
4000
4000
－
316
1206
－
－
3000
2000
G
L
0.85
1.15
1.9
D
F
－
2000
325
432
1210
1812
N
Y
2.0 max
2.5
M
M
－
－
500（T），1000（P）
500
2.5
Note : ※.LW Reverse type（□WK）
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
6
■PARTS NUMBER
Part number 1
Q
(at 1MHz)
min
Soldering
R:Reflow
W:Wave
Thickness*3
[mm]
HTLT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
Part number 2
Rated voltage [V]
Rated voltage x ％
UMK105 CH101JV-F
UMK105 CH121JV-F
UMK105 CH151JV-F
UMK105 CH181JV-F
UMK105 CH221JV-F
UMK105 CH271JV-F
UMK105 CH331JV-F
UMK105 CH361JV-F
UMK105 CH391JV-F
UMK105 CH431JV-F
UMK105 CH471JV-F
UMK105 CH511JV-F
UMK105 CH561JV-F
UMK105 CH621JV-F
UMK105 CH681JV-F
UMK105 CH751JV-F
UMK105 CH821JV-F
UMK105 CH102JV-F
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
100 p
120 p
150 p
180 p
220 p
270 p
330 p
360 p
390 p
430 p
470 p
510 p
560 p
620 p
680 p
750 p
820 p
1000 p
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
±5％
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
50
【Temperature Characteristic U△ : U△/U2△】ꢀ0.5mm thickness（V）
Q
(at 1MHz)
min
Soldering
R:Reflow
W:Wave
R
Thickness*3
[mm]
HTLT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
UMK105 UK0R5CV-F
UMK105 UK010CV-F
UMK105 UK1R5CV-F
UMK105 UK020CV-F
UMK105 UK030CV-F
UMK105 UJ040CV-F
UMK105 UJ050CV-F
UMK105 UJ060DV-F
UMK105 UJ070DV-F
UMK105 UJ080DV-F
UMK105 UJ090DV-F
UMK105 UJ100DV-F
UMK105 UJ120JV-F
UMK105 UJ150JV-F
UMK105 UJ180JV-F
UMK105 UJ220JV-F
UMK105 UJ270JV-F
UMK105 UJ330JV-F
UMK105 UJ390JV-F
UMK105 UJ470JV-F
UMK105 UJ560JV-F
UMK105 UJ680JV-F
UMK105 UJ820JV-F
UMK105 UJ101JV-F
UMK105 UJ121JV-F
UMK105 UJ151JV-F
UMK105 UJ181JV-F
UMK105 UJ221JV-F
UMK105 UJ271JV-F
UMK105 UJ331JV-F
UK
UK
UK
UK
UK
UJ
UJ
UJ
UJ
UJ
UJ
UJ
UJ
UJ
UJ
UJ
UJ
UJ
UJ
UJ
UJ
UJ
UJ
UJ
UJ
UJ
UJ
UJ
UJ
UJ
U2K
U2K
U2K
U2K
U2K
U2J
U2J
U2J
U2J
U2J
U2J
U2J
U2J
U2J
U2J
U2J
U2J
U2J
U2J
U2J
U2J
U2J
U2J
U2J
U2J
U2J
U2J
U2J
U2J
U2J
0.5 p
1 p
±0.25pF
±0.25pF
±0.25pF
±0.25pF
±0.25pF
±0.25pF
±0.25pF
±0.5pF
±0.5pF
±0.5pF
±0.5pF
±0.5pF
±5％
410
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
420
R
1.5 p
2 p
430
R
440
R
3 p
460
R
4 p
480
R
5 p
500
R
6 p
520
R
7 p
540
R
8 p
560
R
9 p
580
R
10 p
12 p
15 p
18 p
22 p
27 p
33 p
39 p
47 p
56 p
68 p
82 p
100 p
120 p
150 p
180 p
220 p
270 p
330 p
600
R
640
R
±5％
700
R
±5％
760
R
50
±5％
840
R
±5％
940
R
±5％
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
R
±5％
R
±5％
R
±5％
R
±5％
R
±5％
R
±5％
R
±5％
R
±5％
R
±5％
R
±5％
R
±5％
R
±5％
R
【Temperature Characteristic SL】ꢀ0.5mm thickness（V）
Q
(at 1MHz)
min
Soldering
R:Reflow
W:Wave
Thickness*3
[mm]
HTLT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
UMK105 SL121JV-F
UMK105 SL151JV-F
UMK105 SL181JV-F
UMK105 SL221JV-F
UMK105 SL271JV-F
UMK105 SL331JV-F
SL
SL
SL
SL
SL
SL
120 p
150 p
180 p
220 p
270 p
330 p
±5％
±5％
±5％
±5％
±5％
±5％
1000
200
200
200
200
200
200
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
R
R
R
R
R
R
1000
1000
50
1000
1000
1000
Multilayer Ceramic Capacitors for High Frequency Applications (1GHz+)
●042TYPE
【Temperature Characteristic CH : CH/C0H】ꢀ0.2mm thickness（C）
Q
(at 1GHz)
(min)
300
300
300
300
300
300
300
300
300
300
280
270
260
240
230
Soldering
R:Reflow
W:Wave
Thickness*3
[mm]
HTLT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
TVS042 CH0R2[]C-W
TVS042 CH0R3[]C-W
TVS042 CH0R4[]C-W
TVS042 CH0R5[]C-W
TVS042 CH0R6[]C-W
TVS042 CH0R7[]C-W
TVS042 CHR75[]C-W
TVS042 CH0R8[]C-W
TVS042 CH0R9[]C-W
TVS042 CH010[]C-W
TVS042 CH1R1[]C-W
TVS042 CH1R2[]C-W
TVS042 CH1R3[]C-W
TVS042 CH1R5[]C-W
TVS042 CH1R6[]C-W
TVS042 CH1R8[]C-W
TVS042 CH020[]C-W
TVS042 CH2R2[]C-W
TVS042 CH2R4[]C-W
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
0.2 p
0.3 p
0.4 p
0.5 p
0.6 p
0.7 p
0.75 p
0.8 p
0.9 p
1 p
1.1 p
1.2 p
1.3 p
1.5 p
1.6 p
1.8 p
2 p
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.1pF, 0.25pF
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
25
210
190
180
170
2.2 p
2.4 p
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
22
■PARTS NUMBER
Part number 1
Q
(at 1GHz)
(min)
150
130
120
110
100
90
85
85
80
75
70
65
65
60
60
55
55
50
Soldering
R:Reflow
W:Wave
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
Thickness*3
[mm]
HTLT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
Part number 2
Rated voltage [V]
Rated voltage x ％
TVS042 CH2R7[]C-W
TVS042 CH030[]C-W
TVS042 CH3R3[]C-W
TVS042 CH3R6[]C-W
TVS042 CH3R9[]C-W
TVS042 CH040[]C-W
TVS042 CH4R3[]C-W
TVS042 CH4R7[]C-W
TVS042 CH050[]C-W
TVS042 CH5R1[]C-W
TVS042 CH5R6[]C-W
TVS042 CH060[]C-W
TVS042 CH6R2[]C-W
TVS042 CH6R8[]C-W
TVS042 CH070[]C-W
TVS042 CH7R5[]C-W
TVS042 CH080[]C-W
TVS042 CH8R2[]C-W
TVS042 CH090[]C-W
TVS042 CH9R1[]C-W
TVS042 CH100[]C-W
TVS042 CH110JC-W
TVS042 CH120JC-W
TVS042 CH130JC-W
TVS042 CH150JC-W
TVS042 CH160JC-W
TVS042 CH180JC-W
TVS042 CH220JC-W
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
2.7 p
3 p
3.3 p
3.6 p
3.9 p
4 p
4.3 p
4.7 p
5 p
5.1 p
5.6 p
6 p
6.2 p
6.8 p
7 p
7.5 p
8 p
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.1pF, 0.25pF
±0.25pF, 0.5pF
±0.25pF, 0.5pF
±0.25pF, 0.5pF
±0.25pF, 0.5pF
±0.25pF, 0.5pF
±0.25pF, 0.5pF
±0.25pF, 0.5pF
±0.25pF, 0.5pF
±0.25pF, 0.5pF
±0.25pF, 0.5pF
±0.25pF, 0.5pF
±2%, ±5%
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
0.2±0.02
25
8.2 p
9 p
50
45
45
40
40
40
40
40
9.1 p
10 p
11 p
12 p
13 p
15 p
16 p
18 p
22 p
±5%
±5%
±5%
±5%
±5%
±5%
±5%
40
30
●105TYPE
【Temperature Characteristic CH : CH/C0H】ꢀ0.5mm thickness（W）
Q
(at 1GHz)
(min)
300
300
300
300
300
300
300
300
280
270
260
240
230
210
190
180
170
150
130
120
110
99
Soldering
R:Reflow
W:Wave
Thickness*3
[mm]
HTLT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
EVK105 CH0R3BW-F
EVK105 CH0R4BW-F
EVK105 CH0R5BW-F
EVK105 CH0R6BW-F
EVK105 CH0R7BW-F
EVK105 CH0R8BW-F
EVK105 CH0R9BW-F
EVK105 CH010BW-F
EVK105 CH1R1BW-F
EVK105 CH1R2BW-F
EVK105 CH1R3BW-F
EVK105 CH1R5BW-F
EVK105 CH1R6BW-F
EVK105 CH1R8BW-F
EVK105 CH020BW-F
EVK105 CH2R2JW-F
EVK105 CH2R4JW-F
EVK105 CH2R7JW-F
EVK105 CH030JW-F
EVK105 CH3R3JW-F
EVK105 CH3R6JW-F
EVK105 CH3R9JW-F
EVK105 CH4R3JW-F
EVK105 CH4R7JW-F
EVK105 CH5R1JW-F
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
0.3 p
0.4 p
0.5 p
0.6 p
0.7 p
0.8 p
0.9 p
1 p
±0.1pF
±0.1pF
±0.1pF
±0.1pF
±0.1pF
±0.1pF
±0.1pF
±0.1pF
±0.1pF
±0.1pF
±0.1pF
±0.1pF
±0.1pF
±0.1pF
±0.1pF
±5％
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
1.1 p
1.2 p
1.3 p
1.5 p
1.6 p
1.8 p
2 p
16
2.2 p
2.4 p
2.7 p
3 p
±5％
±5％
±5％
3.3 p
3.6 p
3.9 p
4.3 p
4.7 p
5.1 p
±5％
±5％
±5％
±5％
84
±5％
84
±5％
84
【Temperature Characteristic CH : CH/C0H】ꢀ0.5mm thickness（W）
Q
(at 1GHz)
(min)
300
300
300
300
300
300
300
300
280
270
260
240
230
210
190
180
170
150
130
120
110
99
Soldering
R:Reflow
W:Wave
Thickness*3
[mm]
HTLT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
UVK105 CH0R3BW-F
UVK105 CH0R4BW-F
UVK105 CH0R5BW-F
UVK105 CH0R6BW-F
UVK105 CH0R7BW-F
UVK105 CH0R8BW-F
UVK105 CH0R9BW-F
UVK105 CH010BW-F
UVK105 CH1R1BW-F
UVK105 CH1R2BW-F
UVK105 CH1R3BW-F
UVK105 CH1R5BW-F
UVK105 CH1R6BW-F
UVK105 CH1R8BW-F
UVK105 CH020BW-F
UVK105 CH2R2JW-F
UVK105 CH2R4JW-F
UVK105 CH2R7JW-F
UVK105 CH030JW-F
UVK105 CH3R3JW-F
UVK105 CH3R6JW-F
UVK105 CH3R9JW-F
UVK105 CH4R3JW-F
UVK105 CH4R7JW-F
UVK105 CH5R1JW-F
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
CH
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
C0H
0.3 p
0.4 p
0.5 p
0.6 p
0.7 p
0.8 p
0.9 p
1 p
±0.1pF
±0.1pF
±0.1pF
±0.1pF
±0.1pF
±0.1pF
±0.1pF
±0.1pF
±0.1pF
±0.1pF
±0.1pF
±0.1pF
±0.1pF
±0.1pF
±0.1pF
±5％
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
1.1 p
1.2 p
1.3 p
1.5 p
1.6 p
1.8 p
2 p
50
2.2 p
2.4 p
2.7 p
3 p
±5％
±5％
±5％
3.3 p
3.6 p
3.9 p
4.3 p
4.7 p
5.1 p
±5％
±5％
±5％
±5％
84
±5％
84
±5％
84
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
23
Multilayer Ceramic Capacitors
■PACKAGING
①Minimum Quantity
●Taped package
Thickness
Standard quantity [pcs]
Type(EIA)
mm
0.2
code
C, D
C
Paper tape
Embossed tape
□MK042(01005)
□VS042(01005)
□MK063(0201)
□WK105(0204) ※
－
40000
0.2
0.3
P, T
P
15000
10000
20000
15000
0.3
0.2
C
□MK105(0402)
0.3
P
－
0.5
V
10000
□VK105(0402) ※
□MK107(0603)
0.5
W
K
0.45
0.5
4000
－
□WK107(0306) ※
□MR107(0603)
V
4000
－
0.8
A
0.45
0.85
125
0.85
1.15
125
1.6
K
4000
□MK212(0805)
□WK212(0508)
□MR212(0805)
※
D
G
－
3000
－
D
4000
F
□MK316(1206)
□MR316(1206)
－
－
3000
2000
G
L
0.85
1.15
1.9
D
F
－
－
2000
□MK325(1210)
□MR325(1210)
N
2.0max.
2.5
Y
M
M
500（T）, 1000（P）
500
□MK432(1812)
2.5
Note : ※ LW Reverse type.
②Taping material
※No bottom tape for pressed carrier tape
●Card board carrier tape
●Embossed tape
Top tape
Top tape
Base tape
Sprocket hole
Chip cavity
Sprocket hole
Chip cavity
Bottom tape
Base tape
Chip filled
Chip
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E02R01
③Representative taping dimensions
●Paper Tape（8mm wide）
●Pressed carrier tape（ 2mm pitch）
Chip Cavity
Insertion Pitch
Ｆ
Tape Thickness
Type(EIA)
Ａ
Ｂ
Ｔ
T1
□MK063(0201)
0.37
0.67
0.45max.
0.42max.
□WK105(0204) ※
□MK105(0402) （*1 C）
□MK105(0402) （*1 P）
2.0±0.05
0.65
1.15
0.4max.
0.3max.
0.42max.
Unit：mm
0.45max.
Note *1 Thickness, C：0.2mm ,P：0.3mm. ※ LW Reverse type.
●Punched carrier tape （2mm pitch）
Chip Cavity
Type(EIA)
Insertion Pitch
Ｆ
Tape Thickness
Ｔ
Ａ
Ｂ
□MK105 (0402)
□VK105 (0402)
0.65
1.15
2.0±0.05
0.8max.
Unit：mm
●Punched carrier tape （4mm pitch）
Chip Cavity
Insertion Pitch
Ｆ
Tape Thickness
Ｔ
Type(EIA)
Ａ
Ｂ
□MK107(0603)
□WK107(0306)
□MR107(0603)
□MK212(0805)
□WK212(0508)
□MK316(1206)
※
※
1.0
1.8
1.1max.
4.0±0.1
1.65
2.0
2.4
3.6
1.1max.
Note：Taping size might be different depending on the size of the product. ※ LW Reverse type.
Unit：mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E02R01
●Embossed tape（4mm wide）
Chip Cavity
Insertion Pitch
Ｆ
Tape Thickness
Type(EIA)
Ａ
Ｂ
K
T
□MK042(01005)
□VS042(01005)
0.23
0.43
1.0±0.02
0.5max.
0.25max.
Unit：mm
●Embossed tape（8mm wide）
Chip Cavity
Insertion Pitch
Ｆ
Tape Thickness
Type(EIA)
Ａ
Ｂ
K
T
□WK107(0306) ※
□MK212(0805)
1.0
1.8
1.3max.
0.25±0.1
1.65
2.0
2.4
3.6
3.6
□MR212(0805)
4.0±0.1
□MK316(1206)
3.4max.
0.6max.
□MR316(1206)
□MK325(1210)
2.8
□MR325(1210)
Note： ※ LW Reverse type.
Unit：mm
●Embossed tape（12mm wide）
Chip Cavity
Insertion Pitch
Tape Thickness
Type(EIA)
Ａ
Ｂ
Ｆ
K
T
□MK432(1812)
3.7
4.9
8.0±0.1
4.0max.
0.6max.
Unit：mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E02R01
④Trailer and Leader
Blank portion
Chip cavity
Blank portion
Leader
100mm or more
160mm or more
(3.94inches or more)
(6.3inches or more)
400mm or more
(15.7inches or more)
Direction of tape feed
⑤Reel size
t
E
C
B
A
R
D
W
A
B
C
φ13.0±0.2
D
E
R
φ178±2.0
φ50min.
φ21.0±0.8
2.0±0.5
1.0
T
W
4mm wide tape
8mm wide tape
12mm wide tape
1.5max.
2.5max.
2.5max.
5±1.0
10±1.5
14±1.5
Unit：mm
⑥Top Tape Strength
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below.
Pull direction
0～20°
Top tape
Base tape
⑦Bulk Cassette
The exchange of individual specification is necessary.
Please contact Taiyo Yuden sales channels.
Slider
Shutter
2.0＋0/－0.1
1.0＋0/－0.1
1.5＋0.1/－0
12±0.1
Connecting Port
36＋0/－0.2
110±0.7
Unit：mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E02R01
Super Low Distortion Multilayer Ceramic Capacitors , Medium-High Voltage Multilayer Ceramic Capacitors and
High Reliability Application Multilayer Ceramic Capacitors are noted separately.
Multilayer Ceramic Capacitors
■RELIABILITY DATA
1.Operating Temperature Range
Standard
Temperature
－55 to ＋125℃
Compensating（Class1）
High Frequency Type
Specification
Temperature Range
－25 to ＋85℃
－55 to ＋85℃
－55 to ＋125℃
－55 to ＋105℃
－55 to ＋125℃
－55 to ＋85℃
－25 to ＋85℃
－30 to ＋85℃
B
BJ
X5R
X7R
X6S
X7S
X5R
F
Specified
Value
B7
C6
High Permittivity （Class2）
C7
LD(※)
F
Y5V
Note: ※LD Low distortion high value multilayer ceramic capacitor
2. Storage Conditions
Temperature
Standard
－55 to ＋125℃
Compensating（Class1）
High Frequency Type
Specification
Temperature Range
－25 to ＋85℃
－55 to ＋85℃
－55 to ＋125℃
－55 to ＋105℃
－55 to ＋125℃
－55 to ＋85℃
－25 to ＋85℃
－30 to ＋85℃
B
BJ
X5R
X7R
X6S
X7S
X5R
F
Specified
Value
B7
C6
High Permittivity （Class2）
C7
LD(※)
F
Y5V
Note: ※LD Low distortion high value multilayer ceramic capacitor
3. Rated Voltage
Standard
50VDC, 25VDC, 16VDC
Temperature
Specified
Value
Compensating（Class1）
High Frequency Type 50VDC, 25VDC, 16VDC
50VDC, 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC, 2.5VDC
High Permittivity （Class2）
4. Withstanding Voltage （Between terminals）
Temperature
Specified
Standard
Compensating（Class1）
High Frequency Type No breakdown or damage
Value
High Permittivity （Class2）
Class 1
Class 2
Rated voltage×2.5
Test
Applied voltage
Methods and
Duration
Rated voltage×3
1 to 5 sec.
50mA max.
Remarks
Charge/discharge current
5. Insulation Resistance
Temperature
Standard
High Frequency Type
10000 MΩ min.
Compensating（Class1）
Specified
Value
C≦0.047μF : 10000 MΩ min.
C＞0.047μF : 500MΩ・μF
High Permittivity （Class2） Note 1
Test
Applied voltage
Duration
: Rated voltage
Methods and
Remarks
: 60±5 sec.
: 50mA max.
Charge/discharge current
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E02R01
6. Capacitance （Tolerance）
Temperature
0.2pF≦C≦5pF
0.2pF≦C≦10pF
C＞10pF
: ±0.25pF
C□
U□
SL
Standard
: ±0.5pF
: ±5% or ±10%
Compensating（Class1）
Specified
Value
0.2pF≦C≦2pF
C＞2pF
: ±0.1pF
: ±5%
High Frequency Type
CH
BJ, B7, C6, C7, LD(※) : ±10% or ±20%,
F : ＋80/－20%
High Permittivity （Class2）
Note: ※LD Low distortion high value multilayer ceramic capacitor
Class 1
High Frequency Type
Class 2
Standard
C≦10μF
C＞10μF
Test
Preconditioning
None
Thermal treatment （at 150℃ for 1hr） Note 2
Methods and
Remarks
Measuring frequency
Measuring voltage Note
Bias application
1ＭHz±10%
0.5 to 5Vrms
1kHz±10%
1±0.2Vrms
120±10Hz
0.5±0.1Vrms
None
7. Q or Dissipation Factor
C＜30pF : Q≧400＋20C
C≧30pF : Q≧1000
Standard
Temperature
Compensating（Class1）
（C：Nominal capacitance）
Specified
Value
High Frequency Type Refer to detailed specification
High Permittivity （Class2） Note 1
BJ, B7, C6, C7：2.5% max., F：7% max.
Class 1
Class 2
Standard
High Frequency Type
C≦10μF
C＞10μF
Preconditioning
None
Thermal treatment （at 150℃ for 1hr） Note 2
Test
Measuring frequency
Measuring voltage Note 1
Bias application
1ＭHz±10%
1GHz
1ｋHz±10%
1±0.2Vrms
120±10Hz
Methods and
Remarks
0.5 to 5Vrms
0.5±0.1Vrms
None
High Frequency Type
Measuring equipment
Measuring jig
: HP4291A
: HP16192A
8. Temperature Characteristic （Without voltage application）
Temperature Characteristic ［ppm/℃］
Tolerance ［ppm/℃］
C□ :
0
CG,CH, CJ, CK
G : ±30
H : ±60
J : ±120
K : ±250
Standard
U□ : －750
UJ, UK
Temperature
Compensating（Class1）
SL : ＋350 to －1000
Temperature Characteristic ［ppm/℃］
Tolerance ［ppm/℃］
H : ±60
High Frequency Type
C□ :
0
CH
Capacitance
change
Reference
temperature
20℃
Specified
Value
Specification
Temperature Range
B
±10%
－25 to ＋85℃
－55 to ＋85℃
－55 to ＋125℃
－55 to ＋105℃
－55 to ＋125℃
－55 to ＋85℃
－25 to ＋85℃
－30 to ＋85℃
BJ
X5R
X7R
X6S
X7S
X5R
F
±15%
25℃
B7
C6
±15%
25℃
High Permittivity （Class2）
±22%
25℃
C7
±22%
25℃
LD(※)
±15%
25℃
＋30/－80%
＋22/－82%
20℃
F
Y5V
25℃
Note : ※LD Low distortion high value multilayer ceramic capacitor
Class 1
Capacitance at 20℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the
following equation.
（C85－C20）
×106（ppm/℃）
C20×△T
△T＝65
Test
Class 2
Methods and
Remarks
Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following
equation.
Step
B、F
X5R、X7R、X6S、X7S、Y5V
Minimum operating temperature
1
2
3
20℃
25℃
Maximum operating temperature
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E02R01
（C－C2）
C2
×100（%）
C
：Capacitance in Step 1 or Step 3
C2 ：Capacitance in Step 2
9. Deflection
Appearance
Capacitance change : Within ±5% or ±0.5 pF, whichever is larger.
Appearance : No abnormality
Capacitance change : Within±0.5 pF
Appearance : No abnormality
: No abnormality
Standard
Temperature
Compensating（Class1）
High Frequency Type
Specified
Value
Capacitance change : Within ±12.5%（BJ, B7, C6, C7,LD(※)）
Within ±30%（F）
High Permittivity （Class2）
Note: ※LD Low distortion high value multilayer ceramic capacitor
Multilayer Ceramic Capacitors
042, 063, ※105 Type
The other types
Board
Glass epoxy-resin substrate
Test
Thickness
Warp
0.8mm
1.6mm
Methods and
Remarks
1mm
Duration
10 sec.
※105 Type thickness, C： 0.2mm ,P： 0.3mm.
Capacitance measurement shall be conducted
with the board bent
10. Body Strength
Standard
－
Temperature
Specified
Value
Compensating（Class1）
High Frequency Type No mechanical damage.
－
High Permittivity （Class2）
High Frequency Type
Applied force
Duration
: 5N
Test
: 10 sec.
Methods and
Remarks
11. Adhesive Strength of Terminal Electrodes
Temperature
Standard
Specified
Compensating（Class1）
High Frequency Type No terminal separation or its indication.
Value
High Permittivity （Class2）
Multilayer Ceramic Capacitors
042, 063 Type
2N
105 Type or more
5N
Test
Methods and
Remarks
Applied force
Duration
30±5 sec.
12. Solderability
Standard
High Frequency Type At least 95% of terminal electrode is covered by new solder.
Temperature
Specified
Value
Compensating（Class1）
High Permittivity （Class2）
Eutectic solder
H60A or H63A
230±5℃
Lead-free solder
Sn-3.0Ag-0.5Cu
245±3℃
Test
Solder type
Methods and
Remarks
Solder temperature
Duration
4±1 sec.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E02R01
13. Resistance to Soldering
Appearance
: No abnormality
Capacitance change
Q
: Within ±2.5% or ±0.25pF, whichever is larger.
: Initial value
Standard
Insulation resistance
Withstanding voltage
: Initial value
（between terminals） : No abnormality
Temperature
Compensating（Class1）
Appearance
: No abnormality
Capacitance change
Q
: Within ±2.5%
: Initial value
High Frequency Type
Specified
Value
Insulation resistance
Withstanding voltage
: Initial value
（between terminals） : No abnormality
Appearance
: No abnormality
Capacitance change
: Within ±7.5%（BJ, B7, C6, C7, LD(※)）
Within ±20%（F）
High Permittivity （Class2） Note 1
Dissipation factor
: Initial value
Insulation resistance
Withstanding voltage
: Initial value
（between terminals）: No abnormality
Note: ※LD Low distortion high value multilayer ceramic capacitor
Class 1
042, 063 Type
105 Type
Preconditioning
Preheating
None
80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5 min.
270±5℃
150℃, 1 to 2 min.
Solder temp.
Duration
3±0.5 sec.
Recovery
6 to 24 hrs （Standard condition） Note 5
Test
Methods and
Remarks
Class 2
105, 107, 212 Type
042、063 Type
316, 325 Type
Preconditioning
Preheating
Thermal treatment （at 150℃ for 1 hr） Note 2
80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5 min.
270±5℃
80 to 100℃, 5 to 10 min.
150 to 200℃, 5 to 10 min.
150℃, 1 to 2 min.
Solder temp.
Duration
3±0.5 sec.
Recovery
24±2 hrs （Standard condition） Note 5
14. Temperature Cycle (Thermal Shock）
Appearance
: No abnormality
Capacitance change
Q
: Within ±2.5% or ±0.25pF, whichever is larger.
: Initial value
Standard
Insulation resistance
Withstanding voltage
: Initial value
（between terminals） : No abnormality
Temperature
Compensating（Class1）
Appearance
: No abnormality
Capacitance change
Q
: Within ±0.25pF
: Initial value
High Frequency Type
Specified
Value
Insulation resistance
Withstanding voltage
: Initial value
（between terminals） : No abnormality
Appearance
: No abnormality
Capacitance change
: Within ±7.5% （BJ, B7, C6, C7, LD(※)）
Within ±20% （F）
High Permittivity （Class2） Note 1
Dissipation factor
: Initial value
Insulation resistance
Withstanding voltage
: Initial value
（between terminals） : No abnormality
Note: ※LD Low distortion high value multilayer ceramic capacitor
Class 1
None
Class 2
Thermal treatment （at 150℃ for 1 hr）
Note 2
Preconditioning
Step
Temperature（℃）
Time（min.）
Test
1
2
3
4
Minimum operating temperature
Normal temperature
30±3
2 to 3
30±3
2 to 3
Methods and
Remarks
1 cycle
Maximum operating temperature
Normal temperature
Number of cycles
Recovery
5 times
6 to 24 hrs （Standard condition） Note 5
24±2 hrs （Standard condition） Note 5
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E02R01
15. Humidity （Steady State）
Appearance
: No abnormality
Capacitance change
Q
: Within ±5% or ±0.5pF, whichever is larger.
: C＜10pF : Q≧200＋10C
Standard
10≦C＜30pF : Q≧275＋2.5C
C≧30pF:Q≧350（C：Nominal capacitance）
: 1000 MΩ min.
Temperature
Compensating（Class1）
Insulation resistance
Appearance
: No abnormality
: Within ±0.5pF,
: 1000 MΩ min.
Specified
Value
High Frequency Type Capacitance change
Insulation resistance
Appearance
: No abnormality
Capacitance change
: Within ±12.5% （BJ, B7, C6, C7, LD(※)）
Within ±30% （F）
High Permittivity （Class2） Note 1
Dissipation factor
: 5.0% max.（BJ, B7, C6, C7, LD(※)）
11.0% max.（F）
Insulation resistance
: 50 MΩμF or 1000 MΩ whichever is smaller.
Note: ※LD Low distortion high value multilayer ceramic capacitor
Class 1
Class 2
All items
Standard
40±2℃
High Frequency Type
60±2℃
Preconditioning
Temperature
Humidity
None
Thermal treatment（ at 150℃ for 1 hr） Note 2
40±2℃
Test
Methods and
Remarks
90 to 95%RH
90 to 95%RH
Duration
500＋24/－0 hrs
500＋24/－0 hrs
Recovery
6 to 24 hrs （Standard condition） Note 5
24±2 hrs （Standard condition） Note 5
16. Humidity Loading
Appearance
: No abnormality
Capacitance change
: Within ±7.5% or ±0.75pF, whichever is larger.
: C＜30pF：Q≧100＋10C/3
Standard
Q
C≧30pF：Q≧200 （C：Nominal capacitance）
: 500 MΩ min.
Insulation resistance
Temperature
Compensating（Class1）
Appearance
: No abnormality
Capacitance change
: C≦2pF：Within ±0.4 pF
C＞2pF：Within ±0.75 pF
（C：Nominal capacitance）
: 500 MΩ min.
High Frequency Type
Specified
Value
Insulation resistance
Appearance
: No abnormality
Capacitance change
: Within ±12.5% （BJ, B7, C6, C7, LD(※)）
Within ±30% （F）
High Permittivity （Class2） Note 1
Dissipation factor
: 5.0% max. （BJ, B7, C6, C7, LD(※)）
11.0% max. （F）
Insulation resistance
: 25 MΩμF or 500 MΩ, whichever is smaller.
Note: ※LD Low distortion high value multilayer ceramic capacitor
Class 1
Class 2
Standard
High Frequency Type
All items
Preconditioning
Voltage treatment
None
（Rated voltage are applied for 1 hour at 40℃） Note 3
Temperature
Humidity
40±2℃
60±2℃
40±2℃
Test
Methods and
Remarks
90 to 95%RH
500＋24/－0 hrs
Rated voltage
90 to 95%RH
Duration
500＋24/－0 hrs
Rated voltage
Applied voltage
Charge/discharge
current
50mA max.
50mA max.
Recovery
6 to 24 hrs （Standard condition） Note 5
24±2 hrs（Standard condition） Note 5
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E02R01
17. High Temperature Loading
Appearance
: No abnormality
Capacitance change
Q
: Within ±3% or ±0.3pF, whichever is larger.
: C＜10pF： Q≧200＋10C
Standard
10≦C＜30pF：Q≧275＋2.5C
C≧30pF： Q≧350（C：Nominal capacitance）
: 1000 MΩ min.
Temperature
Compensating（Class1）
Insulation resistance
Appearance
: No abnormality
Specified
Value
High Frequency Type Capacitance change
Insulation resistance
: Within ±3% or ±0.3pF, whichever is larger.
: 1000 MΩ min.
Appearance
: No abnormality
Capacitance change
: Within ±12.5% （BJ, B7, C6, C7, LD(※)）
Within ±30% （F）
High Permittivity （Class2） Note 1
Dissipation factor
: 5.0% max.（BJ, B7, C6, C7, LD(※)）
11.0% max.（F）
Insulation resistance
: 50 MΩμF or 1000 MΩ, whichever is smaller.
Note: ※LD Low distortion high value multilayer ceramic capacitor
Class 1
High Frequency Type
Class 2
C6
Standard
BJ, LD(※), F
B7, C7
Voltage treatment（Twice the rated voltage shall be applied for
1 hour at 85℃, 105℃ or 125℃） Note 3, 4
Maximum operating temperature
Preconditioning
None
Temperature
Duration
Maximum operating temperature
1000＋48/－0 hrs
Test
1000＋48/－0 hrs
Methods and
Remarks
Applied voltage
Charge/discharge
current
Rated voltage×2
Rated voltage×2 Note 4
50mA max.
50mA max.
Recovery
6 to 24hr （Standard condition） Note 5
24±2 hrs （Standard condition） Note 5
Note: ※LD Low distortion high value multilayer ceramic capacitor
Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail.
Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature for
24±2hours.
Note 3 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in
the test conditions, and kept at room temperature for 24±2hours.
Note 4 150% of rated voltage is applicable to some items. Please refer to their specifications for further information.
Note 5 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning
measurement results, in order to provide correlation data, the test shall be conducted under the following condition.
Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the
"standard condition".
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E02R01
High Reliability Application Multilayer Ceramic Capacitors are noted separately.
Precautions on the use of Multilayer Ceramic Capacitors
■PRECAUTIONS
1. Circuit Design
◆Verification of operating environment, electrical rating and performance
1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have
severe social ramifications.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from
them used in general purpose applications.
Precautions
◆Operating Voltage （Verification of Rated voltage）
1. The operating voltage for capacitors must always be their rated voltage or less.
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC
voltage or a pulse voltage having rapid rise time is used in a circuit.
2. PCB Design
◆Pattern configurations （Design of Land-patterns）
1. When capacitors are mounted on PCBs, the amount of solder used （size of fillet） can directly affect the capacitor performance.
Therefore, the following items must be carefully considered in the design of land patterns:
（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider
appropriate land-patterns for proper amount of solder.
Precautions
（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by
solder-resist.
◆Pattern configurations （Capacitor layout on PCBs）
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB
cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land
pattern configurations and positions of capacitors shall be carefully considered to minimize stresses.
◆Pattern configurations （Design of Land-patterns）
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
（1）Recommended land dimensions for typical chip capacitors
●Multilayer Ceramic Capacitors : Recommended land dimensions
Land patterns for PCBs
Land pattern
（unit: mm）
Solder-resist
Wave-soldering
Chip capacitor
Type
107
1.6
212
2.0
316
3.2
325
3.2
L
C
Size
W
0.8
1.25
1.6
2.5
A
B
C
0.8 to 1.0
0.5 to 0.8
0.6 to 0.8
1.0 to 1.4
0.8 to 1.5
0.9 to 1.2
1.8 to 2.5
0.8 to 1.7
1.2 to 1.6
1.8 to 2.5
0.8 to 1.7
1.8 to 2.5
B
A
B
Chip capacitor
W
L
Technical
Reflow-soldering
Type 042
considerations
063
0.6
105
1.0
107
1.6
0.8
212
2.0
316
325
3.2
2.5
432
4.5
L
0.4
3.2
Size
W
0.2
0.3
0.5
1.25
1.6
3.2
A
B
C
0.15 to 0.25
0.15 to 0.20
0.15 to 0.30
0.20 to 0.30
0.20 to 0.30
0.25 to 0.40
0.45 to 0.55
0.40 to 0.50
0.45 to 0.55
0.8 to 1.0
0.8 to 1.2
0.8 to 1.2
0.9 to 1.6
1.8 to 2.5
1.0 to 1.5
1.2 to 2.0
1.8 to 2.5
1.0 to 1.5
1.8 to 3.2
2.5 to 3.5
1.5 to 1.8
2.3 to 3.5
0.6 to 0.8
0.6 to 0.8
Note：Recommended land size might be different according to the allowance of the size of the product.
LWDC
●LWDC: Recommended land dimensions for reflow-soldering
（unit: mm）
Type
105
0.52
107
0.8
212
1.25
L
W
Size
W
1.0
1.6
2.0
A
B
C
0.18 to 0.22
0.2 to 0.25
0.9 to 1.1
0.25 to 0.3
0.3 to 0.4
1.5 to 1.7
0.5 to 0.7
0.4 to 0.5
1.9 to 2.1
L
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E02R01
（2）Examples of good and bad solder application
Item
Not recommended
Recommended
Solder-resist
Lead wire of component
Mixed mounting of SMD and
leaded components
Chassis
Solder-resist
Solder (for grounding)
Component placement close to
the chassis
Electrode pattern
Lead wire of component
Soldering iron
Solder-resist
Hand-soldering of leaded
components near mounted
components
Solder-resist
Horizontal component
placement
◆Pattern configurations （Capacitor layout on PCBs）
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any
stresses from board warp or deflection.
possible mechanical
Items
Not recommended
Recommended
Place the product at a right
angle to the direction of the
anticipated mechanical
stress.
Deflection of board
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
E
D
Perforation
C
A
B
Slit
Magnitude of stress A＞B＝C＞D＞E
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods
are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,
split methods as well as chip location.
3. Mounting
Precautions
◆Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2. Maintenance and inspection of mounting machines shall be conducted periodically.
◆Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the
following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and
hardening period. Therefore, please contact us for further information.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E02R01
◆Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid
this, the following points shall be considerable.
（1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
（2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
（3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be
used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle
placement:
Item
Improper method
Proper method
chipping
or cracking
Single-sided mounting
supporting pins
or back-up pins
Double-sided mounting
chipping
or cracking
supporting pins
or back-up pins
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical
impact on the capacitors.
Technical
considerations
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of
the pin shall be conducted periodically.
◆Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in
stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect
components. Therefore, the following precautions shall be noted in the application of adhesives.
（1）Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f. The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
（2）The recommended amount of adhesives is as follows;
［Recommended condition］
Amount adhesive
After capacitor are bonded
a
a
Figure
212/316 case sizes as examples
a
b
c
0.3mm min
100 to 120μm
b
Adhesives shall not contact land
c
c
4. Soldering
◆Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
（1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equivalent） of halogenated content. Flux having a strong acidity content shall
not be applied.
（2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
（3）When water-soluble flux is used, special care shall be taken to properly clean the boards.
Precautions
◆Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.） content is used to activate flux, or highly acidic flux is used, it may lead to
corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted
and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high
humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning
methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used.
Technical
considerations
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E02R01
◆Soldering
･ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
･ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal
shock.
･ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within
100 to 130℃.
･ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.
［Reflow soldering］
【Recommended conditions for eutectic
soldering】
300
【Recommended condition for Pb-free
soldering】
300
Peak
Preheating
230℃
260℃ Max.
Within 10sec.
Within 10sec.
60sec. 60sec
Min.
Min.
200
100
0
200
Slow
Slow cooling
cooling
100
Heating above
230℃
Preheating150℃
60sec. Min.
40sec. Max.
0
1/2T～1/3T
Caution
Capacitor
PC board
①The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the
thickness of a capacitor.
Solder
T
②Because excessive dwell times can adversely affect solderability, soldering duration shall
be kept as close to recommended times as possible.
［Wave soldering］
【Recommended conditions for eutectic
【Recommended condition for Pb-free
soldering】
soldering】
300
300
Peak
260℃ Max.
Within 10sec.
230～250℃
Within 3sec.
Preheating
120sec. Min.
120sec. Min.
200
200
100
0
Slow
cooling
Slow cooling
Preheating
150℃
100
0
Caution
①Wave soldering must not be applied to capacitors designated as for reflow soldering only.
［Hand soldering］
【Recommended conditions for eutectic
【Recommended condition for Pb-free
soldering】
soldering】
400
400
400
300
200
100
0
Peak
350℃ Max.
Within 3sec.
Peak
280℃ Max.
Within 3sec.
230～280℃
Within 3sec.
300
300
⊿T
Slow cooling
200
Slow cooling
⊿T
200
Slow cooling
Preheating
150℃ Min.
Preheating
150℃ Min.
100
100
Preheating
60sec. Min.
0
60sec. Min.
60sec. Min.
0
⊿T
⊿T
⊿T≦130℃
316type or less
⊿T≦150℃
325type or more
Caution
①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
②The soldering iron shall not directly touch capacitors.
5. Cleaning
Precautions
◆Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use
of the cleaning. （e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect
capacitor's characteristics.
1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate
their outer coating, resulting in a degradation of the capacitor's electrical properties （especially insulation resistance）.
2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead
the capacitors.
to the
Technical
cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall
be carefully checked;
considerations
Ultrasonic output :
20 W/ℓ or less
40 kHz or less
Ultrasonic frequency :
Ultrasonic washing period : 5 min. or less
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E02R01
6. Resin coating and mold
1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the
while left under normal storage conditions resulting in the deterioration of the capacitor's performance.
hardening period or
Precautions
2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat
may lead to damage or destruction of capacitors.
The use of such resins, molding materials etc. is not recommended.
7. Handling
◆Splitting of PCB
1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.
2. Board separation shall not be done manually, but by using the appropriate devices.
Precautions
◆Mechanical considerations
Be careful not to subject capacitors to excessive mechanical shocks.
（1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.
（2）Please be careful that the mounted components do not come in contact with or bump against other boards or
components.
8. Storage conditions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature : Below 30℃
Humidity
: Below 70% RH
Precautions
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as
time passes, so capacitors shall be used within 6 months from the time of delivery.
・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.
2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so
care shall be
taken to design circuits . Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at
150℃ for 1hour.
If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and
quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the
above period, please check solderability before using the capacitors.
Technical
considerations
※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA.
Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E02R01
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